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Vitrified Resin Bond Diamond Backing Grinding Wheel

Enlarged font  Narrow font Release date:2020-04-15  Browse number:5
Note: Diamond grinding wheel for silicon wafers are used to process silicon wafers
 Diamond grinding wheel for silicon wafers are used to process silicon wafers(including the compound semiconductors) to be thin and flat.Diamond Backing Grinding Wheel

Diamond wheel for back grinding are used to grind the back side of silicon wafer in order to improve the quality of processing and reduce grinding damage. It also makes it possible to shorten the processing time because it lightens the polishing process.

 

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